機能材料及び電子設備事業グループ(FMEG, Function Material & Electronic Equipment Group)は当社最初に設立した事業部です。初期は包装と建材用のフィルムの輸出を事業中核として展開し、現在医療、食品分野へも多岐に渡り、光学用フィルムや関連装置、医療機器、健康食品の販売と薬品輸出、建材の代理販売も行っています。
本事業部は海外・国内の実績が持続的に成長しつづあり、商品種類も増加しています。国内・海外顧客のさまざまなニーズに応えられるグローバルな総合商社の機能事業部を目指し、国内企業をサポートしてグローバルへの商機を把握し、顧客と共に市場価値を創造します。
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Agent for LGE silver paste product provide high efficiency solar cell application.
【Product Line Up】
High efficiency n type bifacial solar cell, p type mono and multi conventional solar cell(as 2005), Stencil, PERC for high efficiency solar cell with high quality mass production front-silver solar paste product and customized and process technology integration service.
【Key Features and Benefits】
●Conventional Technology
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
‧ Wide firing window
●Better printability
‧ High resolution : finger widths (≥ 33㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●Stencil Technology
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths(≥ 25㎛ @ Stencil-mesh)
‧ More Excellent fine line uniformity
‧ Good Aspect ratio
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●PERC Technology
●Higher efficiency at PERC
‧ Excellent electrical contact at lower peak firing temperature
‧ Wide firing window & Low firing temperature (30~40℃ lower)
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths (≥ 30㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●n Type Bifacial Technology
Front
‧ For N-type wafer with P+ surface
‧ High electronic efficiency at low temperature
‧ High resolution (≥36㎛)
‧ Low series resistance (Low Rs)
‧ Wide process window
‧ Excellent solderability
Back
‧ For N-type wafer with N+ surface
‧ High electronic efficiency at low temperature
‧ Suitable for emitter designs (≤ 60Ω/sq)
‧ Good yield with lower paste consumption rate
‧ Wide process window
‧ Good solderability
Agent for LGE silver paste product provide high efficiency solar cell application.
【Product Line Up】
High efficiency n type bifacial solar cell, p type mono and multi conventional solar cell(as 2005), Stencil, PERC for high efficiency solar cell with high quality mass production front-silver solar paste product and customized and process technology integration service.
【Key Features and Benefits】
●Conventional Technology
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
‧ Wide firing window
●Better printability
‧ High resolution : finger widths (≥ 33㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●Stencil Technology
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths(≥ 25㎛ @ Stencil-mesh)
‧ More Excellent fine line uniformity
‧ Good Aspect ratio
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●PERC Technology
●Higher efficiency at PERC
‧ Excellent electrical contact at lower peak firing temperature
‧ Wide firing window & Low firing temperature (30~40℃ lower)
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths (≥ 30㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●n Type Bifacial Technology
Front
‧ For N-type wafer with P+ surface
‧ High electronic efficiency at low temperature
‧ High resolution (≥36㎛)
‧ Low series resistance (Low Rs)
‧ Wide process window
‧ Excellent solderability
Back
‧ For N-type wafer with N+ surface
‧ High electronic efficiency at low temperature
‧ Suitable for emitter designs (≤ 60Ω/sq)
‧ Good yield with lower paste consumption rate
‧ Wide process window
‧ Good solderability
何か質問がある場合、
お問い合わせください