Function Material & Electronic Equipment Group (FMEG) is the first founded business unit in SIC. In the beginning, we focused on exporting plastic films for packaging and building materials. Up to now, we extend the product lines to different industries, from optical films, medicines, medical instruments, healthy food to laminate hard plastic sheets. Functional materials and product group grows steadily.
Functional materials and product group grows steadily. The domestic sale and exporting scales are keeping expanding. We aim to be an international comprehensive trading company which provides good services and creates value for our foreign and domestic clients.
If you have any questions
or concerns,
welcome to contact us.
Agent for LGE silver paste product provide high efficiency solar cell application.
【Product Line Up】
High efficiency n type bifacial solar cell, p type mono and multi conventional solar cell(as 2005), Stencil, PERC for high efficiency solar cell with high quality mass production front-silver solar paste product and customized and process technology integration service.
【Key Features and Benefits】
●Conventional Technology
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
‧ Wide firing window
●Better printability
‧ High resolution : finger widths (≥ 33㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●Stencil Technology
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths(≥ 25㎛ @ Stencil-mesh)
‧ More Excellent fine line uniformity
‧ Good Aspect ratio
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●PERC Technology
●Higher efficiency at PERC
‧ Excellent electrical contact at lower peak firing temperature
‧ Wide firing window & Low firing temperature (30~40℃ lower)
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths (≥ 30㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●n Type Bifacial Technology
Front
‧ For N-type wafer with P+ surface
‧ High electronic efficiency at low temperature
‧ High resolution (≥36㎛)
‧ Low series resistance (Low Rs)
‧ Wide process window
‧ Excellent solderability
Back
‧ For N-type wafer with N+ surface
‧ High electronic efficiency at low temperature
‧ Suitable for emitter designs (≤ 60Ω/sq)
‧ Good yield with lower paste consumption rate
‧ Wide process window
‧ Good solderability
Agent for LGE silver paste product provide high efficiency solar cell application.
【Product Line Up】
High efficiency n type bifacial solar cell, p type mono and multi conventional solar cell(as 2005), Stencil, PERC for high efficiency solar cell with high quality mass production front-silver solar paste product and customized and process technology integration service.
【Key Features and Benefits】
●Conventional Technology
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
‧ Wide firing window
●Better printability
‧ High resolution : finger widths (≥ 33㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●Stencil Technology
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths(≥ 25㎛ @ Stencil-mesh)
‧ More Excellent fine line uniformity
‧ Good Aspect ratio
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●PERC Technology
●Higher efficiency at PERC
‧ Excellent electrical contact at lower peak firing temperature
‧ Wide firing window & Low firing temperature (30~40℃ lower)
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths (≥ 30㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●n Type Bifacial Technology
Front
‧ For N-type wafer with P+ surface
‧ High electronic efficiency at low temperature
‧ High resolution (≥36㎛)
‧ Low series resistance (Low Rs)
‧ Wide process window
‧ Excellent solderability
Back
‧ For N-type wafer with N+ surface
‧ High electronic efficiency at low temperature
‧ Suitable for emitter designs (≤ 60Ω/sq)
‧ Good yield with lower paste consumption rate
‧ Wide process window
‧ Good solderability
If you have any questions
or concerns,
welcome to contact us.