机能材料及电子设备事业群(FMEG,Function Material and Electronic Equipment Group)为公司最初成立的事业部门,前身为机能材料及制品事业群。事业初期以包装及建材用的塑胶薄膜商品外销,发展至今产品线横跨异业领域。包括光学膜产品代理及相关设备销售、医药产品外销、国内医疗器材、健康食品及建材产品的代理贩售事业。
本事业群逐年成长,内外销实绩不断扩大,异业横向发展,目标是成为具有国际化综合商社的机能的事业单位,能够服务国内外客户群,与客户共同创造价值。并同时协助国内企业扩大国际市场商机。
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代理LGE 太阳能浆料产品,提供高效太阳能电池应用。
【产品线】
提供高效n型双面、p型传统矽晶太阳能电池(自2005)、与高效无网结与背接触表面钝化太阳能电池高品质量产正银浆料产品,与客制化与技术整合服务。
【主要特色与效益】
●传统制程
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
‧ Wide firing window
●Better printability
‧ High resolution : finger widths (≥ 33㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●无网结技术
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths(≥ 25㎛ @ Stencil-mesh)
‧ More Excellent fine line uniformity
‧ Good Aspect ratio
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●背接触表面钝化技术
●Higher efficiency at PERC
‧ Excellent electrical contact at lower peak firing temperature
‧ Wide firing window & Low firing temperature (30~40℃ lower)
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths (≥ 30㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●n型双面高效池技术
正面
‧ For N-type wafer with P+ surface
‧ High electronic efficiency at low temperature
‧ High resolution (≥36㎛)
‧ Low series resistance (Low Rs)
‧ Wide process window
‧ Excellent solderability
背面
‧ For N-type wafer with N+ surface
‧ High electronic efficiency at low temperature
‧ Suitable for emitter designs (≤ 60Ω/sq)
‧ Good yield with lower paste consumption rate
‧ Wide process window
‧ Good solderability
代理LGE 太阳能浆料产品,提供高效太阳能电池应用。
【产品线】
提供高效n型双面、p型传统矽晶太阳能电池(自2005)、与高效无网结与背接触表面钝化太阳能电池高品质量产正银浆料产品,与客制化与技术整合服务。
【主要特色与效益】
●传统制程
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
‧ Wide firing window
●Better printability
‧ High resolution : finger widths (≥ 33㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●无网结技术
●Higher efficiency
‧ Excellent electrical Contact to n-Si layer
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths(≥ 25㎛ @ Stencil-mesh)
‧ More Excellent fine line uniformity
‧ Good Aspect ratio
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●背接触表面钝化技术
●Higher efficiency at PERC
‧ Excellent electrical contact at lower peak firing temperature
‧ Wide firing window & Low firing temperature (30~40℃ lower)
‧ Suitable for shallow junction emitter ( ≤ 110 Ω/sq )
‧ Low series resistance (Low Rs)
●Better printability
‧ High resolution : finger widths (≥ 30㎛)
‧ Excellent fine line uniformity
●Properties of paste
Properties | Value |
Viscosity Brook Field HB type Cone & Plate CPE-51 Spindle @ 2.5RPM, 25℃ | 100 ± 20 Pa.s |
Solid contents | 91.0 ± 1.0 % |
Fineness of grind (4th / 50%) | <10㎛ / <7㎛ |
●n型双面高效池技术
正面
‧ For N-type wafer with P+ surface
‧ High electronic efficiency at low temperature
‧ High resolution (≥36㎛)
‧ Low series resistance (Low Rs)
‧ Wide process window
‧ Excellent solderability
背面
‧ For N-type wafer with N+ surface
‧ High electronic efficiency at low temperature
‧ Suitable for emitter designs (≤ 60Ω/sq)
‧ Good yield with lower paste consumption rate
‧ Wide process window
‧ Good solderability
还有任何不了解的地方吗?
欢迎洽询本公司