Function Material & Electronic Equipment Group (FMEG) is the first founded business unit in SIC. In the beginning, we focused on exporting plastic films for packaging and building materials. Up to now, we extend the product lines to different industries, from optical films, medicines, medical instruments, healthy food to laminate hard plastic sheets. Functional materials and product group grows steadily.
Functional materials and product group grows steadily. The domestic sale and exporting scales are keeping expanding. We aim to be an international comprehensive trading company which provides good services and creates value for our foreign and domestic clients.
If you have any questions
or concerns,
welcome to contact us.
Product Feature :
(1) IC package with solder bump with precision testing.
(applicable with Sheet/Chip/Strip/Tray).
(2) Equiped with wide range precision CCD with simultaneous
2D/3D processing.
(3) Applicable with round/flatten solder ball.
(4) Tray in / Tray out
(5) Percision
Specification:
TVI-7020-RA
(1)Main inspection item:Bump Height / Bump Coplanarity / C4 Area Warpage
(2)Throughput:4,500 pcs / h
(3)Range:240μm
(4)Resolution:7.8μm
(5)Bump diameter:50μm~150μm
(6)Bump pitch:90μm
(7)Accuracy in height:3σ ave.≦ 1μm
TVI-7040-RA
(1)Resolution:3.0μm
(2)Range:180μm
(3)Bump diameter:50μm~150μm
(4)Bump pitch:55μm
Product Feature :
(1) Flip Chip CCL
(2) SIP.MCM CCL
(3) SRO depth/diameter measurement
(4) Pre-solder ball mass measurment
(5) CCL curvature measurement
Product Feature :
(1) IC package with solder bump with precision testing.
(applicable with Sheet/Chip/Strip/Tray).
(2) Equiped with wide range precision CCD with simultaneous
2D/3D processing.
(3) Applicable with round/flatten solder ball.
(4) Tray in / Tray out
(5) Percision
Specification:
TVI-7020-RA
(1)Main inspection item:Bump Height / Bump Coplanarity / C4 Area Warpage
(2)Throughput:4,500 pcs / h
(3)Range:240μm
(4)Resolution:7.8μm
(5)Bump diameter:50μm~150μm
(6)Bump pitch:90μm
(7)Accuracy in height:3σ ave.≦ 1μm
TVI-7040-RA
(1)Resolution:3.0μm
(2)Range:180μm
(3)Bump diameter:50μm~150μm
(4)Bump pitch:55μm
Product Feature :
(1) Flip Chip CCL
(2) SIP.MCM CCL
(3) SRO depth/diameter measurement
(4) Pre-solder ball mass measurment
(5) CCL curvature measurement
If you have any questions
or concerns,
welcome to contact us.